Die-Cut Solutions to Minimize EMI/RFI in Connected Electronics
The sensitive electronic components that power the interconnected and improved user experience of today’s devices are increasingly susceptible to the challenges associated with electromagnetic interference (EMI) and radio frequency interference (RFI). Without proper shielding and grounding, EMI and RFI can compromise performance by distorting and delaying data. The good news is that in many cases this can be addressed with a piece of custom die-cut specialty tape.